For engineers, selecting a suitable processor for development is a particularly important step, and how to choose a core board that is suitable for their own design and development? Today, we will analyze and compare ST Company’s MP1 series processors.
ST Company has currently released two different types of MPU chips, namely the STM32MP15 series and STM32MP13 series, with distinct characteristics. STM32MP15 adopts ARM A7+M4 heterogeneous CPU, which can achieve dual system support for Linux and real-time applications, and has 3D GPU and MIPI display interface; The STM32MP13 series has been refined and simplified compared to the 15 series, with a processor main frequency increased to 1GHz, dual Gigabit Ethernet, and dual CAN FD, which are very suitable for industrial IoT and automotive communication fields; And with a highly cost-effective price and low power consumption mode.As the annual official partner of ST, Mir Electronics has been following ST’s footsteps since 2019 to release the STM32MP151157 and the STM32MP135 series core board, which debuted this year. Mill uses high-performance stamp hole design, with compact size and reliable connection, built-in power management, DDR, EMMC/NAND FLASH chips, making it easy for customers to skip complex power design. The exclusive metal shielding cover can be dustproof and touch proof, and can also be designed with laser engraving according to customer needs.
How to select the appropriate core board for design? We can compare through the following points.
- Different processor performance
The MYC-YA15XC-T core board is based on the STM32MP151 processor, which is a single Cortex-A7+single Cortex-M4 heterogeneous structure.
The MYC-YA157C core board is based on the STM32MP157 processor, which is a dual core Cortex-A7+single Cortex-M4 heterogeneous structure. It also integrates control units such as GPU, MIPI DSI, CAN FD, etc. internally.
The MYC-YF13X core board is based on the STM32MP135 processor, which is a single core Cortex-A7 processor with a maximum frequency of 1GHz. It also integrates control units such as dual gigabit Ethernet and dual CAN FD.
- Different modules
MYC-YA157C has an additional gigabit network PHY chip compared to MYC-YA15XC-T. MYC-YA15XC-T adopts ST’s power management chip, STPMIC1.
- Different sizes
The dimensions of the three modules are different, with MYC-YF13X and MYC-YA15XC-T being 39 * 37mm, and MYC-YA157C core board being 43 * 45mm,
- The PIN connected is different
The number of pin pins in the three modules is different, MYC-YF13X and MYC-YA15XC-T are 148PIN stamp holes and MYC-YA157C core board 164PIN stamp holes.
So how should engineers choose the appropriate module?
Overall, if the project requires high performance, network, display, and other peripheral resources such as can and mipi screens, I suggest using the MYC-YA157C core module. If it is due to cost considerations and does not require too high performance and too many peripheral resources, priority can be given to evaluating the MYC-YA15XC-T core module. For customers who want to upgrade from MCU to Linux operating system and use dual Ethernet, the MYC-YF13X core module can be evaluated. At present, these three products have been applied in industrial interconnection intelligent gateways, smart building access control management, ubiquitous power FTU/DTU, industrial HMI, and other areas.Mill also provides supporting development boards based on the STM32MP1 series core board, providing customers with different design experiences for development. The supporting materials are rich and convenient for developers to evaluate.